Sensor Technology
(1) MEMS process and the new generation solid-state sensor microstructure manufacturing process: deep reactive ion etching (DRIE) process or IGP process; packaging process: such as normal temperature bonding flip-chip welding, stress-free microstructure packaging, multi-chip assembly process New sensors: such as micro-silicon capacitive sensors, micro-silicon mass flow sensors, aerospace dynamic sensors, micro sensors, pressure and acceleration sensors for automobiles, and micro-chemical sensors for environmental protection.
(2) Integrated process and multi-variable composite sensor microstructure integrated manufacturing process; multi-variable composite sensor for industrial control, such as: pressure, static pressure, temperature three-variable sensor, air pressure, wind, temperature, humidity four-variable sensor, micro silicon composite Strain pressure sensor, display sensor.
(3) Intelligent technology and intelligent sensor signal wired or wireless detection, transformation processing, logical judgment, functional calculation, two-way communication, self-diagnosis and other intelligent technologies; intelligent multi-variable sensors, intelligent power sensors and various intelligent sensors, transmission Device.
(4) Networked technology and networked sensors make the sensors have industrial standard interfaces and protocol functions.
Instrument components
(1) Development and improvement of new molding processes for elastic components: electrodeposition molding process, welding molding process; focus on the development of micro-miniature precision bellows with low rigidity, large displacement and long life for aviation and aerospace, and bellows for high temperature and high pressure valves; Develop bellows efficient molding process equipment and performance testing instruments.
(2) Advanced technology for the development of optical components: aspheric optical component design, manufacturing technology, optical multilayer measurement coating technology and new ion-assisted coating technology.
Development of new optical components for fiber optic communications and digital imaging. Such as: micro variable density filter, ultra-narrow band filter, micro lens array, large area polarizing element, aspheric glass-plastic hybrid lens.
(3) Special circuit design technology and manufacturing process to improve the integration of dedicated circuit and personalized service;
Apply software curing technology to develop signal conversion, compensation, linearization, communication, network interface and other special circuits suitable for intelligent and networked sensors and instruments.
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Jingjiang Gisen Technology Co.,Ltd , https://www.gisengroup.com