LED flip chip package advantages and features

Chip-scale packaging, effectively reducing the package size, small, thin and light, to meet the current trend of miniaturization of LED lighting applications, design applications more flexible, breaking the traditional light source size to the design constraints, more suitable for point light source, There are directional projection lighting areas such as projection distance, lighting angle, center illumination, etc., such as backlight, flash, projector, high-brightness lighting (car lights, searchlights, flashlights, work lights, outdoor highbay lights, landscapes, etc.) Etc.), small-angle lighting fixtures, etc. No need for gold wires, brackets, solid crystal glue, etc., to reduce the thermal layer in the intermediate links, can withstand large current, higher safety and reliability.

CSP applications in the light-emitting surface requirements of small, high power requirements of the product, especially the need for light products, there is a focus adjustment requirements, the effect is better, the color can be a single color, PCB using superconducting aluminum gold plating, good heat dissipation, also Can be customized according to customer requirements size and parameters.

Compared with the traditional COB module, CSP will be more flexible in designing ideas, and it is definitely the development trend of LED applications.