With the revolution in portable communications products over the last decade, Rigid Flex PCB Assembly have become a preferred design solution for complex, three-dimensional product assembly, and advanced component surface mounting demands.
Fully Bonded Vs Air Gap Constructions
Higher layer count Rigid Flex PCB Assembly designs may need to utilize an Un-bonded Air Gap construction, a technique which configures layers as separate pairs, as opposed to a single fully bonded unit. The thinner individual pairs provide a higher degree of flexibility.
Aluminum Nitride (AlN) has far better thermal performance (> 150 W/mK) but is also more expensive. Also here thermal performance can be further improved by Ag or Au traces and vias.
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