What has ASUS done in this year's CES VR field?

The annual CES technology exhibition in Las Vegas has come to an end. This year, various hardware manufacturers have made efforts in the field of intelligent hardware. The virtual reality booth is naturally one of the highlights of the CES exhibition. VR all-in-one, VR glasses, VR projection system, VR helmet, VR motherboard and many other hardware products are all unveiled. As a desktop computer manufacturer, ASUS has also contributed a lot in the AR/VR field. Let’s take a look at ASUS this year. Which VR technologies and products were discovered at the CES show.

What has ASUS done in this year's CES VR field? ASUS Releases First Integrated AR/VR Phone ZenFone AR What has ASUS done in this year's CES VR field?

Before the CES show has begun, there will be a Qualcomm blog that ASUS will open the VR smart terminal precedent, and will launch a new smart phone supporting Augmented Reality (AR) and Virtual Reality (VR) for the first time at this year's CES show.

According to the blog post on the Internet, ASUS will launch an integrated AR/VR smartphone at CES, or it will be named “ZenFone AR”, the first smartphone to support both Tango Augmented Reality and Daydram Virtual Reality.

It is reported that the ASUS ZenFone AR mobile phone is equipped with the technology-optimized Qualcomm Snapdragon 821 processor, and is equipped with 8GB of running memory, joined the ASUS triple lens system, and designed specifically for AR augmented reality, ZenFone AR can also be compatible with Google platform and executed. Higher quality action virtual reality.

Before Asustek, Motorola's latest flagship Moto Z was also named the world's first mobile phone that supports AR/VR at the same time. However, foreign media said that Moto Z still needs to add external modules to support Tango. Compared to the audience response at the CES show, the ASUS ZenFone AR phone is generally better, and the ZenFone AR is better known as the first AR/VR device.

It is reported that ZenFone AR will be officially launched in the second quarter of 2017.

Last year, Asus has released VR device ASUS VR

At the just-concluded CES show, ASUS released two new terminal products for smartphones, namely the positioning of the camera and the ARFone 3 Zoom and ZenFone AR in the AR/VR field, further indicating that ASUS is augmented reality AR and The virtual reality VR field continues to exert its strength. In fact, as early as a year ago, Asus has been involved in the VR field. According to the foreign media "DIGITIMES" report and related supply chain Taiwanese disclosure, ASUS has plans to launch VR devices in the first half of 2016, such as the ASUS E-sports game released with the release. This ROG GT51, ROG G20CB and cost-effective notebook G11, has sufficient performance firepower to support the top game and VR experience.

What has ASUS done in this year's CES VR field?

ASUS released the esport game this ROG GT51

On May 31, 2016, at Computex TAIPEI 2016, ASUS understated its own VR glasses ASUS VR. It is understood that ASUS VR is a similar product to Gear VR, which needs to be equipped with ASUS specific mobile phones, such as ASUS ZenFone mobile phone.

On July 12, 2016, ASUS announced that it has launched AntVR-Ready's water-cooled PC computer, which supports plug-and-play of ant vision helmets. At the same time, ASUS announced that the two parties will jointly launch the "VR glasses + Asustek computer" package to promote the sales of VR products and PC computers.

Also on August 13, 2016, ASUS and Guanghui City and Intel officially released the VR Designer designer's exclusive host, which is the world's first VR host specially designed for designers. Intel has made chip-optimized hosts for VR applications and is certified by Intel and ASUS's authoritative hardware labs.

Originally, ASUS was originally scheduled to launch AR-based products in the second half of 2016, or officially launched at CES2017 this year. However, according to various sources, ASUS officially decided to launch mobile VR products at the CES show, namely ZenFone AR, and PC version. VR glasses are postponed for release later in 2017.

According to the disclosure, ASUS's own PC VR solution features multi-platform support and is compatible with platforms such as Steam, Oculus, and Tencent. In addition, more vendors will join the support list. According to ASUS CEO Shen Zhen, the original team responsible for the tablet business has been transferred to the development of VR virtual reality helmet, and finally the device including the host, helmet, joystick controller, etc., will be in January 2017. Public appearance at the CES Consumer Electronics Show.

In addition, Shen Zhenlai also revealed that Asustek plans to release the VR all-in-one in the third quarter of next year, with cameras, sensors and controllers.

ASUS launches PC VR, launches new motherboard and mini VR-ready computer What has ASUS done in this year's CES VR field?

At this year's CES show, ASUS introduced a new generation of VivoPC X for VR and an "Epic" motherboard supporting Intel's next-generation Kaby Lake desktop processor to provide support for virtual reality PC VR.

It is reported that the ASUS VivoPC X is extremely compact and designed for the VR gaming experience. Compared with the huge size and weight of the traditional chassis, VivoPC X officially recommends that the weight does not exceed 2.25kg, and the space is not too small.

VivoPC X features Intel i5 Kaby Lake processor and high-performance Nvidia GTC 1060 graphics card with 8GB RAM + 512 SSD solid state drive and rich I/O interface options: four USB 3.1 ports, two USB 2.0 ports, Ethernet , 3.5mm audio port, two HDMI and one G-Sync that supports DisplayPort.

Compared with traditional manufacturers, ASUS's VR-ready this year is really eye-catching. Compared with several mini-hosts released before, Vivo PC X is also considered a "pocket" version, because of the high-speed performance of games in a small space. And to ensure that the cooling system is good enough, put high requirements on the internal system and the heat dissipation of the chassis.

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